SPUTTER COATER: K650X

K650X Large Sample Coater with Triple Head Sputtering

There are three magnetron target assemblies in the K650X, positioned to give coating over a large diameter which, together with a rotating sample table, ensures even depositions. This method allows standard targets to be utilised, and avoids the necessity of special large profiled targets.

This triple sputter target system is particularly useful in the Semiconductor Wafer Industry.

The magnetron target assemblies employed on this system enhance the efficiency of the process using low voltages, and giving a fine grain, cool sputtering, without the need to cool the target or the specimen stage.

The Instrument is fitted with three 60mm diameter and 0.1mm thick gold (or Customer choice) quick change targets, giving optimum consumable cost performance.

The integrated instrument panel and plug-in electronics, maximise 'up-time' and, with user friendly designs, ensure satisfactory multi-user discipline.

The sputtering parameters can be pre-set, including the gas bleed needle valve which has electromagnetic valve back-up which, together with automatic control, gives defined and repeatable film thickness depositions.

The sputtering head is interlocked, and the system can easily accommodate the K250 Carbon Coating Attachment.

The independent vacuum pump is controlled by the instrument throughout the fully automatic coating cycle.

The K650XT Turbo Unit is as detailed above but has turbo pumping at 60L/Second for a higher & cleaner vacuum.

Features

• Triple target sputtering system
• Fully Automatic Control
• Low Voltage Sputtering
• High Resolution Fine Coating (Order of 2nm Gold Grain)
• Special Rotating Stage with full Tilt Facility fitted as standard
• Even Thickness Deposition (Typically 20nm or 200 Angstroms for SEM work)
• 225mm Diameter (6 inches) Chamber
• Can be integrated with Film Thickness Monitor

Benefits

• Ideal for large samples such as silicon wafers
• Easy to operate
• No cooling required
• Precise Reproducible Coatings
• Fully adaptable to a wide range of specimens
• Repeatable film thickness depositions.
• Easy loading and unloading of large samples – up to 6” wafers
• Can pre-set deposition thickness

Specification

• Instrument Case: 450mm W x 350mm D x 175mm H
• Work Chamber: Borosilicate Glass 225mm Dia x 125mm H
• plus base: 110mm Dia x 115mm H
• Safety Shield: Polycarbonate
• Weight: 24Kg
• Target: Three x 60mm Dia x 0.1mm Thick.
• Rotating: 155mm Dia. Adjustable
• Specimen Stage: Height spacing to target 40 to 50mm
• Vacuum Gauge Range: ATM - 1x10^-2 mbar
• Deposition Range: 0 - 100mA
• Deposition Rate: 0 - 20nm/Minute
• Sputter Timer: 0 - 4 minutes
• Services
• Argon: Nominal 4 psi
• Vacuum Pump: Pump No. 10 10m3/Hr complete with vacuum hose and Oil Mist Filter
• Electrical Supply: 230 Volts 50Hz (8 amp Max.

   

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