SPUTTER COATERS K675X & K675CD

High Resolution Large Chamber Sputter Coaters

Complete 8 inch (200mm) wafers can be coated in The K675X Sputtering Coater System. The base system with twin gear rotating sample stage gives a progressive elliptical rotation for even sputtering desposition.

The K675X Coating System employs a magnetron target assembly which enhances the efficiency of the Sputtering process using low voltages, giving a thin and fine grain coating.

There are three such target assemblies in the K675X, positioned to give coating over a large diameter which, together with a rotating sample table, ensures even depositions. This method allows standard targets to be utilised, and avoids the necessity of special large profile targets.

The multi-target system is particularly useful in the semi-conductor wafer industry. It has a turbomolecular pump backed by a Rotary Vacuum Pump.

The integrated instrument panel and plug-in electronics maximise 'up-time' and, with user-friendly designs, ensures satisfactory multi-user discipline.

The sputtering parameters can be pre-set, including the gas bleed needle valve, which has electromagnetic valve back-up.

The independent Vacuum Pump is controlled by the Instrument throughout the fully automatic coating cycle. It can be used to Sputter Coat targets such as Gold, and also targets that may need pre-cleaning, or the removal of oxide layers, such as Chromium.

A shutter assembly is fitted as standard, which allows a Sputter Cleaning and the Sputter Cycle to be carried out while maintaining the vacuum.

Features

Benefits

• Allows coating of large samples such as 8” wafers
• Allows sputtering of fine grain oxidising metals such as Cr or Ir
• Easy to operate
• No cooling water required
• Ultra high resolution reproducible coatings
• Fully adaptable to a wide range of specimens
• Repeatable film thickness depositions
• Easy loading and unloading of samples such as 8” wafers

Specification of K675X Sputtering Coater System

• Instrument Case: 450mm W x 500mm D x 300mm H (Overall height of unit 630mm)
• Work Chamber: Borosilicate Glass 300mm Dia. x 200mm H
• Safety Shield: Polycarbonate.
• Weight: 42Kg
• Targets: Three x 54mm Dia. x 0.3mm Thick Chromium fitted as standard
• Rotating Specimen Stage: Adjustable for 6 to 8 inch Wafers, Height spacing to target 60mm
• Vacuum Gauge: Atmos. - 1 x 10^-5 mbar
• Deposition: 0 - 450mA
• Deposition Rate: 0 - 15nm/minute
• Sputter Timer: 0 - 4 minutes
• Supply: 230 Volts 50Hz (8 Amp Max including pump)
• Services
• Argon: Nominal 10 psi
• Nitrogen: Nominal 10 psi (Argon may be used as common gas)
• Rotary Backing Pump: Two Stage Vacuum Pump No.2, 35L/Min complete with Vacuum Hose and Oil Mist Filter. 2m3/Hr.

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