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EQUIPOS DE PREPARACIÓN DE MUESTRAS: RF Plasma Etching / Ashing  

 

FEDELCO, S.L.

 

RF PLASMA ETCHING / ASHING:

    The plasma process is accomplished through the use of a low pressure, RF induced gaseous discharge. The specimen is loaded into the reaction chamber and the chamber is evacuated to a vacuum pressure of 0.1 - 2.2 torr. A carrier gas is then introduced into the chamber, raising the chamber pressure to 0.3 - 1.2 torr, depending on the application.

    RF power is applied around the chamber. This excites the carrier gas molecules and dissociates it into chemically active atoms and molecules. The mechanism employed in this process is one of ionization. The combustion products, which are completely dissociated and harmless, are carried away in the gas stream. The unique property of this process is that it occurs at relatively low temperatures without employing toxic chemicals.

    The Plasma process is accomplished through the use of a low pressure, RF induced gaseous discharge, this glow discharge having a characteristic colour depending on the gas being used.

    With Oxygen as the process gas the molecules disassociate into chemically active atoms and molecules, the ‘combustion’ products are carried away in the gas stream by the Vacuum System.

    The unique property of the process is the relatively low temperature at which it occurs when ashing typically organic material and avoiding the use of chemicals for etching processes.

    The K1050X consists of a Solid State RF Generator and associated tuning circuits, Dual Process gas with flow monitoring needle valve control and Full or Restricted vent control. It has a Cylindrical Chamber with a Rack Out Draw system for ease of sample loading.

    The Vacuum System is external with Standard Rotary Pump or Optional Turbo Pump backed by a Diaphragm Pump. The Rack Out Drawer System can be exchanged for a Vacuum Loading Port, for special cleaning applications in TEM. This usually employs an Oxygen/Argon mix of gases, the Oxygen removing Organic material (hydrocarbons) and the Argon giving surface etching of the sample.


K1050X RF plasma Etcher / Asher / Cleaner

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ÁREAS DE TRABAJO:

EQUIPOS PREPARACIÓN DE MUESTRAS
MATERIAL DE MICROSCOPIA ELECTRÓNICA
MATERIAL GENERAL DE LABORATORIO

Materiales de Referencia Certificados

Microbiología

 STANDARDS

Accesorios IR

Control de Calidad

 NOVEDADES


FEDELCO, S.L.      C/ Lago Constanza, 46  28017 MADRID      TEL: 91 408 16 25      FAX: 91 408 16 90       E-mail: informacion@fedelco.com       Web: www.fedelco.com